Date of Award
5-1-2006
Document Type
Thesis
Degree Name
M.S. in Engineering Science
First Advisor
Dr. Jeffrey A. Roux
Second Advisor
Dr. Tyrus A. McCarty
Third Advisor
Dr. Atef Z. Elsherbeni
Relational Format
Dissertation/Thesis
Abstract
Much focus has been placed on the thermal management of electronics in recent years. An overall reduction in size of electronic components as well as advances in chip technology leading to higher power dissipation have increased the necessity for innovative cooling designs. Thermal engineers have been highly dependent on computational fluid dynamic software packages to assist in the design of these cooling systems. These software packages allow engineers to vary parameters in order to optimize their designs without the time and cost involved in building and testing multiple prototypes. However, it remains important to experimentally test some designs to verify the results of the computational simulations. The present work focuses on the experimental evaluation of several cooling designs for a generic power amplifier module. Computational simulations have been conducted on each of the proposed designs in order to optimize certain parameters. The purpose of the current work is to validate the results of these computational simulations through experiments.
Recommended Citation
Williams, Zachary A., "Experimental evaluation of cooling methods for a high density packing array of power amplifiers" (2006). Electronic Theses and Dissertations. 3215.
https://egrove.olemiss.edu/etd/3215