Date of Award
1-1-2023
Document Type
Thesis
Degree Name
M.S. in Engineering Science
First Advisor
Yiwei Han
Second Advisor
Shan Jiang
Third Advisor
Taiho Yeom
School
University of Mississippi
Relational Format
dissertation/thesis
Abstract
Highly integrated on-demand printed electronics have gained lots of popularity recently. Most of the fabrication methods that are currently used in the industry are constraints to one technology and also one material class. These also limit the geometry design and the resolution of the finished products. To address this problem, the hybrid printing process is a promising technique to effectively fabricate 3D electronics. Hybrid printing is the future of printed electronics.
In the study, a high-resolution (~100 microns) hybrid printing process has been developed which combines extrusion-based printing (EBP) and Electrohydrodynamic (EHD) printing with polymeric and metallic material respectively. In our experiment, we characterized and verified the effect of several critical parameters like printing speed, pressure, voltage, and overlap on the printing method and quality of the printed features. To obtain high-efficient and high-resolution printing, the optimal set of printing parameters was identified. The optimal printing result obtained for PLA 1st layer is pressure 0.8kg/cm2, speed 1mm/s, overlap 25%. The best printing results for PLA 2nd layer are speed 0.4mm/s, pressure 1kg/cm2, and overlap 11%. For metal EHD printing, the best results obtained are speed 0.3mm/s, and voltage 1.5KV. Finally, a hybrid printing system is applied to fabricate high-resolution 3D electronics which demonstrates the potential capabilities of developed hybrid printing process for producing customized 3D microelectronic.
Recommended Citation
Yasmin, Nusrat, "High-Resolution Hybrid Printing of 3D Electronics" (2023). Electronic Theses and Dissertations. 2734.
https://egrove.olemiss.edu/etd/2734